APA:
Yusoff, Asliza, Abu Baka, Maria, Jalar, Azman (2022). Temperature-induced thickness reduction of micromechanical properties of Sn-0.7Cu solder alloy.
Materiali in tehnologije, letnik 56, številka 4, str. 373-379.
URN:NBN:SI:DOC-HPCG41DL from http://www.dlib.si
MLA:
Yusoff, Asliza, Abu Baka, Maria, Jalar, Azman. "Temperature-induced thickness reduction of micromechanical properties of Sn-0.7Cu solder alloy."
Materiali in tehnologije letnik 56. številka 4 (2022) str. 373-379.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-HPCG41DL>