URN:NBN:SI:DOC-HPCG41DL2022Abu Baka, MariaJalar, AzmanYusoff, Aslizadocuments/doc/H/URN_NBN_SI_doc-HPCG41DL_001.pdfdocuments/doc/H/URN_NBN_SI_doc-HPCG41DL_001.txt456articlestr. 373-37910.17222/mit.2022.3921188431391580-2949URN:NBN:SI:doc-HPCG41DLengInštitut za kovinske materiale in tehnologijeMateriali in tehnologijeInCmicromechanical propertiesmikromehanske lastnostinanoindentacijananoindentationsolder alloytermomehanska obdelavathermomechanical treatmentzlitina za spajkanjeTemperature-induced thickness reduction of micromechanical properties of Sn-0.7Cu solder alloyTemperaturno inducirano zmanjšanje debeline in mikromehanskih lastnosti zlitine za spajkanje Sn-0,7Cu