APA:
Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum (2012). The limited reliability of board-level SAC solder joints under both mechanical and thermo-mechanical loads.
Informacije MIDEM, letnik 42, številka 1, str. 3-10.
URN:NBN:SI:DOC-XYPU132Y from http://www.dlib.si
MLA:
Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum. "The limited reliability of board-level SAC solder joints under both mechanical and thermo-mechanical loads."
Informacije MIDEM letnik 42. številka 1 (2012) str. 3-10.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-XYPU132Y>