The surface gold electroplated layer appears an important role for hermetic relays, simultaneously decreasing contact resistance and increasing their lifetime. Silver alloy (Ag with 0,1 wt. % Mg) is gold electroplated, the thickness of gold layer is approximately ?$0,5\mu$?. Annealing at 135°C and 200°C provide a surface of extremely low autgassing at contact operation. The surface gold layer is investigated by means of Auger Electron Spectroscopy and the outgassed products by means of mass spectroscopy in the experimental system which was developed and build for this purpose at the Institute for Electronics and Vacuum Technique. Gold electroplating and subsequent annealing improve the desorption of surface and produce relatively dry surface low outgassing state.

Rights

URN

URN:NBN:SI:DOC-VJZJZZKU

COBISS ID

17305605

Added

22.07.2011

Metadata

Citation

APA:

Koller, Lidija, Vrhovec, Stane, Jenko, Monika (1995). Zmanjšana stopnja razplinjevanja elektrokemijsko zlatenih srebrnih kontaktnih površin v hermetičnih relejih, volume 29, issue 5/6. URN:NBN:SI:DOC-VJZJZZKU from http://www.dlib.si

MLA:

Koller, Lidija, Vrhovec, Stane, Jenko, Monika. Zmanjšana stopnja razplinjevanja elektrokemijsko zlatenih srebrnih kontaktnih površin v hermetičnih relejih. Inštitut za kovinske materiale in tehnologije
Železarna Jesenice
Železarna Ravne
Železarna Štore, 1995.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-VJZJZZKU>

Kovine zlitine tehnologije
1992-1999
(Assembly record)

prejšnja

Karakterizacija Zn-Ni-Ti-O keramike
1995
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Dim pri varjenju z oplaščenimi elektrodami
1995
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