APA:
Musztyfaga, Małgorzata, Janicki, Damian, Panek, Piotr, Kurilla, Peter (2018). Use of a laser disc for cutting silicon wafers.
Materiali in tehnologije, volume 52, issue 2, str. 139-142.
URN:NBN:SI:DOC-R8TTAZPP from http://www.dlib.si
MLA:
Musztyfaga, Małgorzata, Janicki, Damian, Panek, Piotr, Kurilla, Peter. "Use of a laser disc for cutting silicon wafers."
Materiali in tehnologije volume 52. issue 2 (2018) str. 139-142.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-R8TTAZPP>