Analiza vezanega prenosa toplote v hladilniku elektronskega čipa
An analysis of conjugate heat transfer in the heat sink of an electronic chip

english
slovenian

2002

volume 48, issue 9

Univerza v Ljubljani, Fakulteta za strojništvo

This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelly-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminium pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh revals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu. The influence of conductivity becomes larger with increasing Reynolds number.

16.09.2009