Primerjava vakuumsko razplinjenih in plazemsko čiščenih kontaktnih materialov za elektronske sestavne dele
Comparison of vacuum outgassed and plasma cleaned contact materials for electronic components

slovenian

1997

volume 31, issue 1/2

Narodna in univerzitetna knjižnica

Analysis of the measurements of some contact material characteristics (AgNiO.10, AgNiO.15, AgCdO) and state of their contact surface showed that contact resistance ?$(R_k$?) does not exactly obey the F relation. ?$R_k$? is dependent on the mechanical characteristics of material through in the range of contact forces from 3cN up to approximately 15cN it is also dependent on the thin layer of impurities on the surface. With a measuring system for establishing the mechanical parameters of contacts these impurities can be detected also after cleaning with freon ?$CCl_2F_2$? but not after plasma cleaning. Contact forces in miniature electronic components (e.g.relays) are often above 15cN. In that case the cleaning of metal with vacuum outgassing is sufficient. Vacuum outgassing indicates the adsorbed and deposited impurities on the contact surface so their origin can be determined. It can be concluded that for the relays with the contact force below 15cN better results are achieved with the plasma cleaning while for those above 15cN vacuum outgassing of contact material is sufficient. However, cleaning methods with freon are being abandoned nowadays.

22.07.2011