APA:
Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum (2011). A review on thermal cycling and drop impact realiability of solder joints in electronic packages.
Informacije MIDEM, volume 41, issue 3, str. 186-192.
URN:NBN:SI:DOC-DXPYDTSQ from http://www.dlib.si
MLA:
Shnawah, Dhafer Abdulameer, Sabri, Mohd Faizul Mohd, Badruddin, Irfan Anjum. "A review on thermal cycling and drop impact realiability of solder joints in electronic packages."
Informacije MIDEM volume 41. issue 3 (2011) str. 186-192.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-DXPYDTSQ>