<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-XML551F3</identifier><date>2002</date><creator>Griese, Hansjoerg</creator><creator>Mueller, Jutta</creator><creator>Reichl, Herbert</creator><creator>Zuber, Karl-Heinz</creator><relation>documents/doc/X/URN_NBN_SI_doc-XML551F3_001.pdf</relation><relation>documents/doc/X/URN_NBN_SI_doc-XML551F3_001.txt</relation><format format_type="volume">32</format><format format_type="issue">4</format><format format_type="type">article</format><format format_type="extent">str. 262-268</format><identifier identifier_type="ISSN">0352-9045</identifier><identifier identifier_type="COBISSID">214735104</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-XML551F3</identifier><language>eng</language><publisher>Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</publisher><source>Informacije MIDEM</source><rights>InC</rights><subject language_type_id="eng">environmental protection</subject><subject language_type_id="slv">spajkanje</subject><subject language_type_id="slv">spajke</subject><subject language_type_id="slv">svinec</subject><subject language_type_id="slv">varstvo okolja</subject><title>Lead free interconnection technology and the environment</title><title>Tehnologije povezav brez svinca za ohranjanje okolja</title></Record>