<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-UEXX1PQH</identifier><date>2016</date><creator>Glinšek, Sebastjan</creator><creator>Kmet, Brigita</creator><creator>Malič, Barbara</creator><creator>Pečnik, Tanja</creator><relation>documents/doc/U/URN_NBN_SI_doc-UEXX1PQH_001.pdf</relation><relation>documents/doc/U/URN_NBN_SI_doc-UEXX1PQH_001.txt</relation><format format_type="issue">3</format><format format_type="volume">46</format><format format_type="type">article</format><format format_type="extent">str.136-141</format><identifier identifier_type="ISSN">0352-9045</identifier><identifier identifier_type="COBISSID_HOST">29942311</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-UEXX1PQH</identifier><language>eng</language><publisher>Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</publisher><source>Informacije MIDEM</source><rights>InC</rights><title>Solution-derived Basub(0.5)Srsub(0.5)TiOsub3 thin-film capacitors in metal-insulator-metal configuration</title><title>Tankoplastni kondenzatorji na osnovi Baspodaj(0.5)Srspodaj(0.5)TiOspodaj3, pripravljenega s sintezo v raztopini, s konfiguracijo kovina - dielektrik - kovina</title></Record>