<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-QBVUM07W</identifier><date>2025</date><creator>El Bouslemti, Rahmouna</creator><relation>documents/doc/Q/URN_NBN_SI_doc-QBVUM07W_001.pdf</relation><relation>documents/doc/Q/URN_NBN_SI_doc-QBVUM07W_001.txt</relation><format format_type="issue">5</format><format format_type="volume">92</format><format format_type="type">article</format><format format_type="extent">str. 276-281</format><identifier identifier_type="ISSN">0013-5852</identifier><identifier identifier_type="COBISSID">280548611</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-QBVUM07W</identifier><language>eng</language><publisher publisher_location="Ljubljana">Elektrotehniška zveza Slovenije</publisher><source>Elektrotehniški vestnik</source><rights>InC</rights><subject language_type_id="slv">dielektrična konstanta</subject><subject language_type_id="slv">mikrovalovne aplikacije</subject><subject language_type_id="slv">tiskana vezja</subject><subject language_type_id="slv">zmogljivost materialov</subject><title>Towards a miniaturized microstrip attenuator with the composite material film</title></Record>