<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-JQPFFVZY</identifier><date>2012</date><creator>Muck, Deja</creator><relation>documents/doc/J/URN_NBN_SI_doc-JQPFFVZY_001.pdf</relation><relation>documents/doc/J/URN_NBN_SI_doc-JQPFFVZY_001.txt</relation><format format_type="volume">41</format><format format_type="issue">8</format><format format_type="type">article</format><format format_type="extent">str. 30-33</format><identifier identifier_type="ISSN">0350-6614</identifier><identifier identifier_type="COBISSID_HOST">363968</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-JQPFFVZY</identifier><language>slv</language><publisher publisher_location="Ljubljana">GZS - Združenje papirne in papirno predelovalne industrije</publisher><source>Papir (Ljubljana)</source><rights>InC</rights><subject language_type_id="slv">električni senzorji</subject><subject language_type_id="slv">embalaža</subject><subject language_type_id="slv">NFC</subject><subject language_type_id="slv">pametna embalaža</subject><subject language_type_id="slv">papirništvo</subject><subject language_type_id="slv">plin</subject><subject language_type_id="slv">prevodno črnilo</subject><subject language_type_id="slv">RFID</subject><subject language_type_id="slv">temperatura</subject><subject language_type_id="slv">tiskana elektronika</subject><subject language_type_id="slv">vlaga</subject><title>Printed electronics, basis for future packaging</title><title>Tiskana embalaža, osnova embalaža prihodnosti</title></Record>