703 KB21 KB198520252002Tušek, JanezUran, Miroštevilka:1letnik:32str. 39-43ISSN:0352-9045COBISSID:890305URN:URN:NBN:SI:doc-JLWE3IUTenStrokovno društvo za mikroelektroniko, elektronske sestavne dele in materialeInformacije MIDEManalizabakerkontaktni materialispajkespojisrebroAnalysis of a brazed joint of silver and copper| Analiza spajkanega spoja srebra in bakra|The paper describes a practical application of resistance brazing to joining of a silver element and a copper element to make a contact element to be used in electrical engineering. First the two elements to be brazed are shown schematically. By means of an Auger electron spectrometer a chemical analysis of both surfaces to be joined by brazing, i.e. the copper-element surface and the surface of the filler metal placed at the surface of the silver element, is made. The experimental part schematically shows the principle of resistance welding and brazing, and diagrams show variations of current and voltage drop in both workpieces during brazing as a function of time. An analysis of the brazed joint included assessment of joint quality and of the occurence of pores or other imperfections of the cross section of the joint. At individual locations of the joint, a chemical composition was analysed with a scanning electron microscope JEOL JSM with an energy disperse X-ray analyser. The conclusions drawn indicate that the technology applied to joining of silver and copper in the electrotechnical industry is quite suitable, although costly. From the points of view of technology and economy it would be reasonable to investigate a possibility of welding silver and copper, i.e. joining without the application of brazing filler metalV članku je prikazan praktični potek elektrouporovnega spajkanja elementa iz srebra in elementa iz bakra, ki se vgrajujeta kot kontaktni element v elektrotehniki. Najpraj sta shematsko prikazana oba elementa, ki ju spajkamo, s spektrometrom Augerjevih elektronov pa je narejena kemična analiza obeh površin, ki se med spajkanjem spojita. To sta površina bakrenega elementa in površina spajke, ki se že pred spajkanjem nahaja na površini srebrnega elementa. V okviru eksperimentalnega dela je shematsko prikazan princip uporovnega varjenja, v diagramih pa sta prikazana potek jakosti toka in padca napetosti v obeh spajkancih med spajkanjem v odvisnosti od časa. Pri analizi samega spoja smo na prečnem prerezu spoja ugotavljali kakovost spoja, prisotnost morebitnih por ali drugih napak. Na posameznih mestih pa smo z vrstičnim elektronskim mikroskopom JEOL JSM z energijskim disperzijskim analizatorjem rentgenskih žarkov analizirali kemično sestavo. Na koncu članka smo podali zaključke, ki pravijo, da je tehnologija spajanja z bakrom za elektrotehnično industrijo popolnoma ustrezna, toda nekoliko draga. Z ekonomskega in tehnološkega vidika bi bilo smisleno raziskati tudi tehnologijo varjenja srebra in bakra, t.j. spajanje brez uporabe spajkeTEXTznanstveno časopisjejournalsSlovenian National E-content AggregatorNational and University Library of SloveniaStrokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale