21 KB932 KB20 KB199219991997Musil, Jindrichštevilka:1/2letnik:315 stranistr. 107-111ISSN:1318-0010COBISSID:68010URN:URN:NBN:SI:doc-HOZNHQ5HenInštitut za kovinske materiale in tehnologijeŽelezarna JeseniceŽelezarna RavneŽelezarna ŠtoreKovine zlitine tehnologijemagnetroninaparevanjenaprševanjeplazmatanke plastiSputtering of thin films| Naprševanje tankih plasti|The sputtering and evaporation of solid materials are fundamental physical processes now currently used in the Physical Vapour Deposition (PVD) of thin films. Up to the mid 70's, however, evaporation dominated over sputtering in PVD technologies. It was due mainly to a verya low sputter deposition rate of the film and relatively high pressures (> 1 Pa) needed to sustain the sputtering discharge. The breakthrough arrived when the planar magnetron was discovered by Chaplin (1) in 1974. From this moment a very strong development of the sputtering method started. In this paper the main milestones reached in the development of sputtering discharges and deposition of thin films are given. Also, the present trends of the next developments in this field which will meet the requirements of new advanced technologies in the first years of the 21st century are outlinedNaprševanje in izparevanje trdih snovi sta fizikalna procesa, ki sta osnova današnjih fizikalnih (vakuumskih) postopkov nanašanja (PVD) tankih plasti. Do sredine sedemdestih let je naparevanje prevladovalo v PVD tehnologijah. To pa v glavnem zaradi majhne hitrosti nanašanja in relativno visokega tlaka (> 1 Pa), ki je bil potreben pri naprševanju za vzdrževanje plazme. Do preloma je prišlo leta 1971, ko je Chaplin razvil magnetron. Od takrat naprej je bil razvoj postopkov naprševanja zelo intenziven. V tem prispevku so podani glavni mejniki pri razvoju le-teh. Osvetlili bomo tudi sedanje trende razvoja na tem področju v luči zahtev sodobnih tehnologij za 21 stoletjeTEXTznanstveno časopisjejournalsSlovenian National E-content AggregatorNational and University Library of Slovenia