<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-FQ93XFZJ</identifier><date>2008</date><creator>Kita, Jarosĺaw</creator><creator>Moos, Ralf</creator><relation>documents/doc/F/URN_NBN_SI_doc-FQ93XFZJ_001.pdf</relation><relation>documents/doc/F/URN_NBN_SI_doc-FQ93XFZJ_001.txt</relation><format format_type="volume">38</format><format format_type="issue">4</format><format format_type="type">article</format><format format_type="extent">str. 219-224</format><identifier identifier_type="ISSN">0352-9045</identifier><identifier identifier_type="COBISSID">7568468</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-FQ93XFZJ</identifier><language>eng</language><publisher>Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</publisher><source>Informacije MIDEM</source><rights>InC</rights><subject language_type_id="slv">debeloplastna tehnologija</subject><subject language_type_id="slv">LTCC tehnologija</subject><subject language_type_id="slv">materiali</subject><subject language_type_id="slv">mikroelektronika</subject><subject language_type_id="slv">sintranje</subject><title>Development of LTCC-materials and their applications - an overview</title><title>Razvoj LTCC materialov in njihova uporaba - pregled</title></Record>