<?xml version="1.0"?><rdf:RDF xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:edm="http://www.europeana.eu/schemas/edm/" xmlns:wgs84_pos="http://www.w3.org/2003/01/geo/wgs84_pos" xmlns:foaf="http://xmlns.com/foaf/0.1/" xmlns:rdaGr2="http://rdvocab.info/ElementsGr2" xmlns:oai="http://www.openarchives.org/OAI/2.0/" xmlns:owl="http://www.w3.org/2002/07/owl#" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:ore="http://www.openarchives.org/ore/terms/" xmlns:skos="http://www.w3.org/2004/02/skos/core#" xmlns:dcterms="http://purl.org/dc/terms/"><edm:WebResource rdf:about="http://www.dlib.si/stream/URN:NBN:SI:doc-BQDPHXTS/57e78e13-8415-4543-8b77-de00b232765a/PDF"><dcterms:extent>4355 KB</dcterms:extent></edm:WebResource><edm:WebResource rdf:about="http://www.dlib.si/stream/URN:NBN:SI:doc-BQDPHXTS/357a6530-982e-4085-bd5e-74cda4889a83/TEXT"><dcterms:extent>88 KB</dcterms:extent></edm:WebResource><edm:TimeSpan rdf:about="1985-2026"><edm:begin xml:lang="en">1985</edm:begin><edm:end xml:lang="en">2026</edm:end></edm:TimeSpan><edm:ProvidedCHO rdf:about="URN:NBN:SI:doc-BQDPHXTS"><dcterms:isPartOf rdf:resource="https://www.dlib.si/details/URN:NBN:SI:spr-Z2J12Z6C" /><dcterms:issued>2025</dcterms:issued><dc:creator>Ambrožič, Vanja</dc:creator><dc:creator>Drobnič, Klemen</dc:creator><dc:creator>Lavrič, Henrik</dc:creator><dc:creator>Nemec, Mitja</dc:creator><dc:creator>Rihar, Andraž</dc:creator><dc:creator>Vončina, Danijel</dc:creator><dc:creator>Zajec, Peter</dc:creator><dc:format xml:lang="sl">številka:1</dc:format><dc:format xml:lang="sl">letnik:55</dc:format><dc:format xml:lang="sl">str. 3-23</dc:format><dc:identifier>ISSN:0352-9045</dc:identifier><dc:identifier>DOI:10.33180/InfMIDEM2025.101</dc:identifier><dc:identifier>COBISSID_HOST:228550915</dc:identifier><dc:identifier>URN:URN:NBN:SI:doc-BQDPHXTS</dc:identifier><dc:language>en</dc:language><dc:publisher xml:lang="sl">Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</dc:publisher><dcterms:isPartOf xml:lang="sl">Informacije MIDEM</dcterms:isPartOf><dc:subject xml:lang="en">design</dc:subject><dc:subject xml:lang="sl">močnostna elektronika</dc:subject><dc:subject xml:lang="sl">načrtovanje</dc:subject><dc:subject xml:lang="en">packaging</dc:subject><dc:subject xml:lang="sl">pakiranje</dc:subject><dc:subject xml:lang="sl">polprevodniki</dc:subject><dc:subject xml:lang="en">power electronics</dc:subject><dc:subject xml:lang="en">semiconductors</dc:subject><dc:subject xml:lang="sl">širok prepovedan pas</dc:subject><dc:subject xml:lang="en">wide bandgap</dc:subject><dcterms:temporal rdf:resource="1985-2026" /><dc:title xml:lang="sl">Challenges for large-scale deployment of WBG in power electronics| Polprevodniki s širokim prepovedanim pasom v pretvornikih močnostne elektronike|</dc:title><dc:description xml:lang="sl">As the demand for efficient and high-performance power electronic devices continues to grow, wide bandgap (WBG) semiconductors have emerged as a promising solution due to their superior characteristics. However, realizing their full potential requires not only the development of advanced semiconductor materials but also the optimization of packaging techniques. This paper examines the crucial role of packaging in leveraging the benefits of WBG devices, with a particular focus on mitigating inductance and addressing other critical concerns. Drawing from previous research and discussions, we explore various strategies to minimize inductance effects, enhance thermal management, ensure reliability, and optimize electrical performance. Through an interdisciplinary approach that encompasses electrical engineering, materials science, and mechanical engineering principles, this paper highlights the latest advancements in WBG device packaging, providing valuable insights for researchers and engineers working towards more efficient and reliable power electronic systems</dc:description><dc:description xml:lang="sl">Ob nenehno naraščajočem povpraševanju po učinkovitih in visokozmogljivih napravah močnostne elektronike, se polprevodniki s širokim prepovedanim pasom (WBG) zaradi svojih izjemnih karakteristik kažejo kot obetavna rešitev. Uresničitev njihovega polnega potenciala poleg razvoja naprednih polprevodniških materialov zahteva tudi optimizacijo tehnik načrtovanja in pakiranja. Članek predstavi ključno vlogo načrtovanja pri izkoriščanju prednosti WBG naprav, s posebnim poudarkom na zmanjševanju induktivnosti in obravnavanju drugih ključnih vprašanj. Na podlagi prejšnjih raziskav in razprav raziskuje različne strategije za zmanjšanje učinkov parazitnih parametrov, izboljšanje odvoda toplote izgubnih moči, zagotavljanje zanesljivosti in optimizacijo električnih zmogljivosti. S pomočjo interdisciplinarnega pristopa, ki zajema načela elektrotehnike, materialov in strojništva, članek poudarja najnovejši napredek pri načrtovanju WBG naprav ter ponuja dragocen vpogled raziskovalcem in inženirjem, ki si prizadevajo za bolj učinkovite in zanesljive sisteme močnostne elektronike</dc:description><edm:type>TEXT</edm:type><dc:type xml:lang="sl">znanstveno časopisje</dc:type><dc:type xml:lang="en">journals</dc:type><dc:type rdf:resource="http://www.wikidata.org/entity/Q361785" /></edm:ProvidedCHO><ore:Aggregation rdf:about="http://www.dlib.si/?URN=URN:NBN:SI:doc-BQDPHXTS"><edm:aggregatedCHO rdf:resource="URN:NBN:SI:doc-BQDPHXTS" /><edm:isShownBy rdf:resource="http://www.dlib.si/stream/URN:NBN:SI:doc-BQDPHXTS/57e78e13-8415-4543-8b77-de00b232765a/PDF" /><edm:rights rdf:resource="http://creativecommons.org/licenses/by/4.0/" /><edm:provider>Slovenian National E-content Aggregator</edm:provider><edm:intermediateProvider xml:lang="en">National and University Library of Slovenia</edm:intermediateProvider><edm:dataProvider xml:lang="sl">Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</edm:dataProvider><edm:object rdf:resource="http://www.dlib.si/streamdb/URN:NBN:SI:doc-BQDPHXTS/maxi/edm" /><edm:isShownAt rdf:resource="http://www.dlib.si/details/URN:NBN:SI:doc-BQDPHXTS" /></ore:Aggregation></rdf:RDF>