<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-B3ABUWCZ</identifier><date>2005</date><creator>Duraj, Aleš</creator><creator>Mach, Pavel</creator><relation>documents/doc/B/URN_NBN_SI_doc-B3ABUWCZ_001.pdf</relation><relation>documents/doc/B/URN_NBN_SI_doc-B3ABUWCZ_001.txt</relation><format format_type="volume">35</format><format format_type="issue">4</format><format format_type="type">article</format><format format_type="extent">str. 228-235</format><identifier identifier_type="ISSN">0352-9045</identifier><identifier identifier_type="COBISSID">5219924</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-B3ABUWCZ</identifier><language>eng</language><publisher>Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</publisher><source>Informacije MIDEM</source><rights>InC</rights><subject language_type_id="slv">komponente brez svinca</subject><subject language_type_id="slv">lepila</subject><subject language_type_id="slv">lepljenje</subject><subject language_type_id="slv">spajkanje</subject><title>Adhesive joining or lead-free soldering?</title></Record>