<Record><identifier xmlns="http://purl.org/dc/elements/1.1/">URN:NBN:SI:doc-6ISTCHU1</identifier><date>2005</date><creator>Eveloy, Valérie</creator><creator>Fukuda, Yuki</creator><creator>Ganesan, Sanka</creator><creator>Pecht, Michael</creator><creator>Wu, Ji</creator><relation>documents/doc/6/URN_NBN_SI_doc-6ISTCHU1_001.pdf</relation><relation>documents/doc/6/URN_NBN_SI_doc-6ISTCHU1_001.txt</relation><format format_type="volume">35</format><format format_type="issue">4</format><format format_type="type">article</format><format format_type="extent">str. 196-212</format><identifier identifier_type="ISSN">0352-9045</identifier><identifier identifier_type="COBISSID">5218900</identifier><identifier identifier_type="URN">URN:NBN:SI:doc-6ISTCHU1</identifier><language>eng</language><publisher>Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale</publisher><source>Informacije MIDEM</source><rights>InC</rights><subject language_type_id="eng">Electronika</subject><subject language_type_id="slv">elektronika</subject><subject language_type_id="slv">komponente brez svinca</subject><subject language_type_id="slv">mikroelektronika</subject><subject language_type_id="slv">svinec</subject><subject language_type_id="slv">tehnologija brez svinca</subject><title>WEEE, RoHS, and what you must do to get ready for lead-free electronics</title></Record>