<?xml version="1.0"?><rdf:RDF xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:edm="http://www.europeana.eu/schemas/edm/" xmlns:wgs84_pos="http://www.w3.org/2003/01/geo/wgs84_pos" xmlns:foaf="http://xmlns.com/foaf/0.1/" xmlns:rdaGr2="http://rdvocab.info/ElementsGr2" xmlns:oai="http://www.openarchives.org/OAI/2.0/" xmlns:owl="http://www.w3.org/2002/07/owl#" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:ore="http://www.openarchives.org/ore/terms/" xmlns:skos="http://www.w3.org/2004/02/skos/core#" xmlns:dcterms="http://purl.org/dc/terms/"><edm:WebResource rdf:about="http://www.dlib.si/stream/URN:NBN:SI:DOC-PASCPMEJ/84ebd02d-d3f9-4cdf-abea-89928c58b2d4/PDF"><dcterms:extent>1507 KB</dcterms:extent></edm:WebResource><edm:WebResource rdf:about="http://www.dlib.si/stream/URN:NBN:SI:DOC-PASCPMEJ/f0290a6a-f0b8-4c43-ab8b-c68b92e6aca2/TEXT"><dcterms:extent>0 KB</dcterms:extent></edm:WebResource><edm:TimeSpan rdf:about="2014-2025"><edm:begin xml:lang="en">2014</edm:begin><edm:end xml:lang="en">2025</edm:end></edm:TimeSpan><edm:ProvidedCHO rdf:about="URN:NBN:SI:DOC-PASCPMEJ"><dcterms:isPartOf rdf:resource="https://www.dlib.si/details/URN:NBN:SI:spr-QCV9XF2O" /><dcterms:issued>2025</dcterms:issued><dc:creator>Gao, X.</dc:creator><dc:creator>Jing, G.</dc:creator><dc:creator>Liu, Y.</dc:creator><dc:creator>Yang, M.</dc:creator><dc:creator>Yang, X.</dc:creator><dc:creator>Zheng, H.</dc:creator><dc:format xml:lang="sl">letnik:20</dc:format><dc:format xml:lang="sl">številka:4</dc:format><dc:format xml:lang="sl">str. 458-474</dc:format><dc:identifier>DOI:10.14743/apem2025.4.552</dc:identifier><dc:identifier>ISSN:1854-6250</dc:identifier><dc:identifier>COBISSID_HOST:265921027</dc:identifier><dc:identifier>URN:URN:NBN:SI:doc-PASCPMEJ</dc:identifier><dc:language>en</dc:language><dc:publisher xml:lang="sl">Fakulteta za strojništvo, Inštitut za proizvodno strojništvo</dc:publisher><dcterms:isPartOf xml:lang="sl">Advances in production engineering and management</dcterms:isPartOf><dc:subject xml:lang="en">class imbalance</dc:subject><dc:subject xml:lang="en">class overlap</dc:subject><dc:subject xml:lang="en">defect detection</dc:subject><dc:subject xml:lang="sl">iskanje napak</dc:subject><dc:subject xml:lang="en">machine learning</dc:subject><dc:subject xml:lang="en">multi-objective feature selection</dc:subject><dc:subject xml:lang="sl">preverjanje kakovosti</dc:subject><dc:subject xml:lang="en">quality inspection</dc:subject><dc:subject xml:lang="en">self-paced ensemble</dc:subject><dc:subject xml:lang="en">semiconductor manufacturing</dc:subject><dc:subject xml:lang="sl">strojno učenje</dc:subject><dcterms:temporal rdf:resource="2014-2025" /><dc:title xml:lang="sl">A multi-objective feature selection and self-paced ensemble framework for semiconductor defect detection|</dc:title><dc:description xml:lang="sl">In semiconductor manufacturing, defect detection is commonly performed using high-dimensional process data. These data often exhibit class imbalance and class overlap, which create challenges for achieving reliable classification performance. To address these issues, this study proposes a multi-objective feature selection and self-paced ensemble (MOFS-SPE) framework. The framework employs a multi-objective evolutionary algorithm based on decomposition (MOEA/D) for feature selection. In this process, the area under the precision–recall curve (AUPRC) and the R-value are used as objective functions to identify feature subsets that are highly relevant to quality outcomes. In addition, the framework integrates the self-paced ensemble (SPE) with tree-based classifiers to handle imbalanced and overlapping data. Experiments conducted on a real semiconductor manufacturing dataset (SECOM dataset) demonstrate the effectiveness of the proposed approach. Compared with using the full feature set, the selected features increase the area under the receiver operating characteristic curve (AUROC) from 0.685 to 0.770 and the AUPRC from 0.932 to 0.972. When applying the SPE framework, the specificity of the decision tree model improves from 0.048 to 0.667, thereby enhancing the reliability of identifying defective products. Overall, the proposed framework provides a useful reference for intelligent quality inspection in semiconductor production environments</dc:description><edm:type>TEXT</edm:type><dc:type xml:lang="sl">znanstveno časopisje</dc:type><dc:type xml:lang="en">journals</dc:type><dc:type rdf:resource="http://www.wikidata.org/entity/Q361785" /></edm:ProvidedCHO><ore:Aggregation rdf:about="http://www.dlib.si/?URN=URN:NBN:SI:DOC-PASCPMEJ"><edm:aggregatedCHO rdf:resource="URN:NBN:SI:DOC-PASCPMEJ" /><edm:isShownBy rdf:resource="http://www.dlib.si/stream/URN:NBN:SI:DOC-PASCPMEJ/84ebd02d-d3f9-4cdf-abea-89928c58b2d4/PDF" /><edm:rights rdf:resource="http://creativecommons.org/licenses/by/4.0/" /><edm:provider>Slovenian National E-content Aggregator</edm:provider><edm:intermediateProvider xml:lang="en">National and University Library of Slovenia</edm:intermediateProvider><edm:dataProvider xml:lang="sl">Univerza v Mariboru, Fakulteta za strojništvo</edm:dataProvider><edm:object rdf:resource="http://www.dlib.si/streamdb/URN:NBN:SI:DOC-PASCPMEJ/maxi/edm" /><edm:isShownAt rdf:resource="http://www.dlib.si/details/URN:NBN:SI:DOC-PASCPMEJ" /></ore:Aggregation></rdf:RDF>