A review on thermal cycling and drop impact realiability of solder joints in electronic packages

URN:NBN:SI:DOC-DXPYDTSQ2011Badruddin, Irfan AnjumSabri, Mohd Faizul MohdShnawah, Dhafer Abdulameerdocuments/doc/D/URN_NBN_SI_doc-DXPYDTSQ_001.pdfdocuments/doc/D/URN_NBN_SI_doc-DXPYDTSQ_001.txt341articlestr. 186-1920352-9045263053568URN:NBN:SI:doc-DXPYDTSQengStrokovno društvo za mikroelektroniko, elektronske sestavne dele in materialeInformacije MIDEMInCelektronska vezjamehanske lastnostispajkanjespojitermične lastnostiA review on thermal cycling and drop impact realiability of solder joints in electronic packages