URN:NBN:SI:DOC-B7M84KAH2021Huang, Bao-YuJiang, Jia-xingLv, SongMa, XuTang, Ji-JunWu, Yi-minZhang, Jingdocuments/doc/B/URN_NBN_SI_doc-B7M84KAH_001.pdfdocuments/doc/B/URN_NBN_SI_doc-B7M84KAH_001.txt255articlestr. 293-30410.17222/mit.2020.1911580-294961187843URN:NBN:SI:doc-B7M84KAHengInštitut za kovinske materiale in tehnologijeMateriali in tehnologijeInCdinamična termomehanska analiza (DMA)dynamic thermomechanical analysis (DMA)isothermal curingizotermalno utrjevanjenanocompositesnanokompozitipolimetakrilimidpolymethacrylimideSiO2Isothermal curing kinetics of polymethacrylimide/nano SiO2 composites based on a dynamic thermomechanical analysisIzotermalna kinetika utrjevanja polimetakrilimida/nano-SiO2 kompozitov na osnovi dinamične termohemanske analize