APA:
Collander, Paul (2002). Packaging and interconnect for RF and microwave.
Informacije MIDEM, volume 32, issue 4, str. 269-271.
URN:NBN:SI:DOC-2T3KLZMR from http://www.dlib.si
MLA:
Collander, Paul. "Packaging and interconnect for RF and microwave."
Informacije MIDEM volume 32. issue 4 (2002) str. 269-271.
<http://www.dlib.si/?URN=URN:NBN:SI:DOC-2T3KLZMR>